SAC305 Solder Paste LF Lead-free 500g T4 Type 4

Description:
Kester NXG33 is a lead-free, no-clean and halogen- free solder paste with state-of-the-art capabilities to support modern electronics assembly challenges. Kester NXG33 is fully capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. NXG33 can handle a wide variety of printer variables, including print speed, long idle times and a wide range of temperature and humidity. Post-soldering, the NXG33 offers minimized defects, including headin- pillow and QFN/BGA voiding. This paste meets the IPC definition for halogen-free and is classified as type ROL0 per IPC J-STD-004B. Kester NXG33 is available in Type 4 powder with the SAC305 alloy.